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Stacked MCP Technology
MEMS Sensor Packageing and Testing
The main business scope involves: sinle/double/multi-laver boards, FPC, hich-density boards, etc. We havethe entire process from SMT assembly, DIP insertion to testing and assembly.
QFN
DFN
COB
SOP7
SOP8
SOP16
ESOP8
DIP7
DIP8
Full-automatic SMT lines, auto-insertion machines, odd-form inserters.
System ControlERP, SMT ERROR-Proofing, Lot Trace, MES systems OBO Unit Tracking Waste Heat Recovery for Cost Efficiency
Our IC Division specializes in 0EM various C related services for customers, with products covering multiple series such as power management, LED, motor drivers, MCU, and intelligent control. The products are applicable to household appliances, industrial control equipment, new energy, etc.