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Founded in 2000, HBGK covers an area of 390000 square feet. We specialize in the research and production of sensors, as well as the design and manufacturing of integrated circuits and electronic circuit boards. It is a national high-tech enterprise and a national technology-based enterprise. The company currently has over 120 employees, with R&D technicians accounting for more than 60%.

Obtained 110 national patents.ISO9001;ISO14001;ISO50001;IATF16949; Certificate of Intellectual Property Management System;ROHS;Certificate of Integration of Digitalization and Automation System.

  • 26years

    Professional Manufacturing Experience

  • 36000㎡

    One-stop Smart Factory

  • 120+

    Existing Employees

  • 110+

    Granted Patents

  • 2+

    R&D & Manufacturing Centers


Our Path
2000 Corporate Founded

SMT Division was established, initiating PCB OEM services, mainly serving Fortune 500 companies and listed companies globally. And the ERP system and SMT system were launched year by year, with the MES system providing comprehensive control.

2000
2012 New Factory Constructed

Build a 36,000 ㎡ one-stop intelligent factory. A monitoring center was established to monitor the factory area and production, as well as safety and fire protection, achieving the informatization of financial management.

2012
2016 IC Division Established

The sales volume of IC division has been steadily increasing. From 2017 to 2022, the packaging and testing business of IC division has witnessed explosive growth, with the output increasing tenfold over the past five years.

2016
2018 Sensor Division & Pinghu Factory Established

Self-developed sensors and sensor modules. In the same year, the Pinghu Factory was established. Introduce the OBO traceability system to achieve two-way traceability of products and materials. The ERP, MES, Lot trace and OBO individual piece traceability systems have been launched, achieving full coverage of digital full-process management of products.

2018
2020 Self-Developed Pressure Sensors Launched

The in-house processing mode of Nidec was introduced,and the number of customers continued to grow. IC packaging & testing, sensor OEM, and PCBA businesses continue to develop. Annual output of sensors: 300 million points per year.

2020
2024 New Sensor Product Line Launched

The new flow sensors, current sensors, pressure transmitters and temperature & humidity sensors developed by the Sensor BU have been successively launched on the market.

2024
Built from the Ground Up

Since 2000, we've been on the factory floor — assembling, testing, refining. What began as automotive electronics PCBA manufacturing for Japanese and European automotive brands evolved into something larger: a realisation that the sensors our customers needed most were the ones we could design ourselves. So we did.

Today, HBGK designs its own MEMS pressure, flow, and temperature sensor chips from our R&D center in Wuxi, Jiangsu, China. We package and test them on fully automated in-house production lines across a 36,000-square-meter campus. We calibrate every sensor on our own test benches before shipment. Our automotive credentials are proven on the road — we hold IATF 16949 certification and have delivered PCBA as a qualified Tier-2 supplier to FAW-Volkswagen for ambient lighting and headlight control systems.

We also operate fully automated IC packaging and testing lines with a monthly output exceeding 80 million units. Our factory includes Class 100 and Class 1,000 cleanrooms supporting COB packaging and MEMS sensor assembly.

No black-box supply chains. No quality gaps between chip design, packaging, testing, and final delivery. Just 25 years of manufacturing discipline, applied to every sensor and every chip we ship.

Our Clients

Trusted by Global Leaders

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Our mission

It’s a story about passion, perseverance, and partner trust.

HBGK was established with a bold vision: to redefine electronic manufacturing excellence through high-precision processing. What began as a quality-focused team has evolved into a national high-tech enterprise, driven by innovation and customer-centricity. Over the years, we’ve achieved milestones by pioneering MEMS sensor technologies, building smart manufacturing capabilities, and earning trust from global industry leaders. This success belongs to every partner joining us in pursuing better, more reliable manufacturing. Today, our story remains rooted in one truth: great achievements come from great collaboration. We’re proud of our journey and excited for the next chapter—one we’ll write with you.